Cart (0)
  • No items in cart.
Total
$0
There is a technical issue about last added item. You can click "Report to us" button to let us know and we resolve the issue and return back to you or you can continue without last item via click to continue button.
Home
Content
Tour
eLibrary
Store
Search book title
Enter keywords for book title search
Search book content
Enter keywords for book content search
Filters:
FORMAT
BOOKS
All Books
PACKAGES
All Packages
EDITION
to
PUBLISHER
AABC
(1)
AAMI
(326)
ACI
(573)
AISC
(44)
ASA
(234)
ASCE
(969)
ASHRAE
(652)
ASME
(2114)
ASSE
(64)
ASTM
(92448)
AWC
(54)
AWWA
(541)
BHMA
(117)
BICSI
(33)
BIFMA
(21)
BOMA
(20)
BSI
(93277)
CHD
(3)
CRSI
(17)
IAHSS
(1)
IAPMO
(351)
ICC
(300)
IEEE
(6217)
IES
(240)
ISEA
(16)
Joint Commission
(177)
Joint Commission Int.
(1)
NETA
(5)
NFPA
(1635)
TCNA
(16)
TMS
(19)
USGBC
(28)
WILEY
(4)
 
AR
(6)
AZ
(7)
CA
(115)
CT
(3)
FL
(57)
ID
(5)
IL
(5)
IN
(1)
KY
(1)
LA
(2)
MI
(25)
MN
(26)
NC
(27)
NJ
(13)
NY
(61)
OH
(24)
OR
(22)
PA
(7)
RI
(8)
SC
(20)
SD
(1)
TX
(3)
VA
(50)
VT
(6)
WA
(31)
CONTENT TYPE
 Act
 Admin Code
 Announcements
 Bill
 Book
 CADD File
 CAN
 CEU
 Charter
 Checklist
 City Code
 Code
 Commentary
 Comprehensive Plan
 Conference Paper
 County Code
 Course
 DHS Documents
 Document
 Errata
 Executive Regulation
 Federal Guideline
 Firm Content
 Guideline
 Handbook
 Interpretation
 Journal
 Land Use and Development
 Law
 Legislative Rule
 Local Amendment
 Local Code
 Local Document
 Local Regulation
 Local Standards
 Manual
 Model Code
 Model Standard
 Notice
 Ordinance
 Other
 Paperback
 PASS
 Periodicals
 PIN
 Plan
 Policy
 Product
 Product - Data Sheet
 Program
 Provisions
 Requirements
 Revisions
 Rules & Regulations
 Standards
 State Amendment
 State Code
 State Manual
 State Plan
 State Standards
 Statute
 Study Guide
 Supplement
 Sustainability
 Technical Bulletin
 All
  • BSI
    BS EN IEC 61189-5-601:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
    Edition: 2021
    $473.45
    / user per year

Description of BS EN IEC 61189-5-601:2021 2021

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts). The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.

Standard NumberBS EN IEC 61189-5-601:2021
TitleTest methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
StatusDefinitive
Publication Date2021-03-19
Identical National Standard OfEN 61189-5-601 Ed.1.0, IEC 61189-5-601 Ed1.0
DescriptorsPrinting board, Heat resistance, Resistance (electrical), Testing, Electrical equipment
ICS31.180 Printed circuits and boards, 19.080 Electrical and electronic testing
CommitteeEPL/501
ISBN978 0 580 96584 5
PublisherBSI
Pages46

About BSI

BSI Group, also known as the British Standards Institution is the national standards body of the United Kingdom. BSI produces technical standards on a wide range of products and services and also supplies certification and standards-related services to businesses.
GROUPS
X